APPARATUSES INCLUDING INTERCONNECT STRUCTURES INCLUDING DIELECTRIC MATERIAL SURROUNDED BY CONDUCTIVE MATERIAL, AND RELATED MEMORY DEVICES

APPARATUSES INCLUDING INTERCONNECT STRUCTURES INCLUDING DIELECTRIC MATERIAL SURROUNDED BY CONDUCTIVE MATERIAL, AND RELATED MEMORY DEVICES

An apparatus comprising at least one contact structure. The at least one contact structure comprises a contact, an insulating material overlying the contact, and at least one contact via in the insulating material. The at least one contact structure also comprises a dielectric liner material adjacen...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Li, Xiao, Xu, Lifang, Greenlee, Jordan D, McTeer, Everett A, Klein, Rita J
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus comprising at least one contact structure. The at least one contact structure comprises a contact, an insulating material overlying the contact, and at least one contact via in the insulating material. The at least one contact structure also comprises a dielectric liner material adjacent the insulating material within the contact via, a conductive material adjacent the dielectric liner material, and a stress compensation material adjacent the conductive material and in a central portion of the at least one contact via. The stress compensation material is at least partially surrounded by the conductive material. Memory devices, electronic systems, and methods of forming the apparatus are also disclosed.