THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD

THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND PRINTED WIRING BOARD

Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness.In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: DAIGO, Yoshikazu
Format: Patent
Sprache:eng
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:Provided is a thermosetting resin composition capable of achieving both thermal conductivity and dielectric breakdown resistance at high levels and forming a cured product with a surface having high smoothness.In a thermosetting resin composition, a thermosetting resin, a thermally conductive filler, a rheology modifier, and a wet dispersant are mixed to be solvent-free, and a thixotropic index at 25° C. is adjusted to 0.9 or more and less than 1.0.