SEMICONDUCTOR DEVICE

Provided here are: a board; a cavity region therein having an opening created on a front side of a central portion of the board; a back-side conductor that is formed for the board to provide a bottom portion of the cavity region; a semiconductor chip mounted on the back-side conductor; and a mold ma...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IWAI, Yuji, KUMA, Takahiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Provided here are: a board; a cavity region therein having an opening created on a front side of a central portion of the board; a back-side conductor that is formed for the board to provide a bottom portion of the cavity region; a semiconductor chip mounted on the back-side conductor; and a mold material that covers the semiconductor chip and the board; wherein the mold material has a portion on the front side of the board and a portion on the back side thereof that are interconnected through at least one hole provided in the board, thereby to prevent failures such as a deformation, a crack, etc. of the board; and to reduce the warpage of the board to prevent the mold material from being peeled off therefrom.