SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF

A method of forming a semiconductor structure includes forming a seed layer on a substrate, forming a photoresist layer on the seed layer with a first opening wider than a second opening, performing an electroplating process with a first plating current to grow a bottom portion of a first metal line...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHEN, Hsiang-Ku, LAI, Ying-Yao, CHEN, Dian-Hau, Chih, Fang-I, HUANG, Chen-Chiu, CHEN, ShuFang, LAN, Jo-Lin, CHANG, Wen-Ling, JANGJIAN, Peng-Chung, LIN, Chi-Feng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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