SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF

A method of forming a semiconductor structure includes forming a seed layer on a substrate, forming a photoresist layer on the seed layer with a first opening wider than a second opening, performing an electroplating process with a first plating current to grow a bottom portion of a first metal line...

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Bibliographische Detailangaben
Hauptverfasser:	SHEN, Hsiang-Ku, LAI, Ying-Yao, CHEN, Dian-Hau, Chih, Fang-I, HUANG, Chen-Chiu, CHEN, ShuFang, LAN, Jo-Lin, CHANG, Wen-Ling, JANGJIAN, Peng-Chung, LIN, Chi-Feng
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of forming a semiconductor structure includes forming a seed layer on a substrate, forming a photoresist layer on the seed layer with a first opening wider than a second opening, performing an electroplating process with a first plating current to grow a bottom portion of a first metal line in the first opening and a bottom portion of a second metal line in the second opening, continuing the electroplating process with a second plating current that is larger than the first plating current to grow a top portion of the first metal line and a top portion of the second metal line, removing the photoresist layer to expose a portion of the seed layer, and removing the exposed portion of the seed layer.