SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PLACING METHOD

A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kohama, Norifumi, Motoda, Kimio, Sugihara, Shintaro, Sugakawa, Kenji, Fukushima, Hideyuki, Wada, Norio
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A substrate processing apparatus is equipped with a holder having, on an attraction surface configured to attract a substrate, a circular central region and an annular outer region disposed outside the central region. The holder includes a first attracting pressure generator configured to generate an attracting pressure in the central region to attract the substrate to the holder; a second attracting pressure generator configured to generate an attracting pressure in the outer region to attract the substrate to the holder; and an external force applier configured to apply an external force to the substrate in the outer region in a direction in which the substrate becomes farther from the holder.