SEMICONDUCTOR PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING SEMICONDUCTOR PROCESSING APPARATUS

A method of manufacturing a semiconductor device includes: performing a first semiconductor process on a semiconductor wafer including a front side and a back side opposing the front side; loading the semiconductor wafer into a semiconductor processing apparatus including a support, a spraying appar...

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Bibliographische Detailangaben
Hauptverfasser:	RHEE, Minwoo, LEE, Hyunjin, KANG, Sujie, MOON, Bumki, LIM, Kyeongbin, PARK, Sunwoo, LEE, Seungdon
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of manufacturing a semiconductor device includes: performing a first semiconductor process on a semiconductor wafer including a front side and a back side opposing the front side; loading the semiconductor wafer into a semiconductor processing apparatus including a support, a spraying apparatus, and a warpage measuring apparatus, wherein the semiconductor wafer is supported by the support, wherein the spraying apparatus is disposed below the semiconductor wafer, and the warpage measuring apparatus is an apparatus configured to measure warpage of the semiconductor wafer; forming a warpage compensation pattern on the back side of the semiconductor wafer using the spraying apparatus until a warpage measurement value of the semiconductor wafer is within a predetermined range, while measuring warpage of the semiconductor wafer using the warpage measuring apparatus; and unloading, from the semiconductor processing apparatus, the semiconductor wafer on which the warpage compensation pattern is formed.