METHOD AND ARRANGEMENT FOR DETERMINING THERMALLY-INDUCED DEFORMATIONS

A method for determining thermally-induced deformation of a structure in a lithographic apparatus, the method including: obtaining timing data for a structure in a lithographic apparatus, wherein the timing data includes timing data for the current state of the structure and timing history data that...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	Martinus VAN DEN NIEUWELAAR, Norbertus Josephus, VAN DAMME, Jean-Philippe Xavier, DE JONG, Frederik Eduard, ERCISLI, Hasret, DOBAN, Alina-Ionela
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for determining thermally-induced deformation of a structure in a lithographic apparatus, the method including: obtaining timing data for a structure in a lithographic apparatus, wherein the timing data includes timing data for the current state of the structure and timing history data that includes timing data for at least one previous state of the structure; and using one or more models to determine thermally-induced deformation data for the structure in dependence on the timing history data and the timing data for the current state of the structure.