SHOWERHEAD AND SUBSTRATE TREATMENT APPARATUS INCLUDING SAME

A substrate treatment apparatus includes a process chamber including a substrate treatment space and a disk on which a substrate is seated; and a showerhead provided on the process chamber, the showerhead including: a body; an inlet space in which a fluid is configured to flow through; and a plurali...

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Bibliographische Detailangaben
Hauptverfasser:	SEO, Dong Won, LEE, Baek Ju, KIM, Sang Yeop, CHEON, Min Ho, CHO, Hyun Chul, HAN, Pil Hee, RYU, Hui Seong
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A substrate treatment apparatus includes a process chamber including a substrate treatment space and a disk on which a substrate is seated; and a showerhead provided on the process chamber, the showerhead including: a body; an inlet space in which a fluid is configured to flow through; and a plurality of spray holes provided on a lower surface of the body and configured to spray the fluid toward a substrate, where the plurality of spray holes are inclined at an angle with respect to the lower surface of the body.