THERMALLY CONDUCTIVE COMPOSITION AND CURED PRODUCT

A thermally conductive composition of the present invention comprises a silicone base material, a viscosity reducing agent, and a thermally conductive filler, wherein a ratio between a weight-average molecular weight Mw1 of the silicone base material and a weight-average molecular weight Mw2 of the...

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Bibliographische Detailangaben
Hauptverfasser:	KANEKO, Toshiki, UMETANI, Hiroshi, IWAMOTO, Tatsuya
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A thermally conductive composition of the present invention comprises a silicone base material, a viscosity reducing agent, and a thermally conductive filler, wherein a ratio between a weight-average molecular weight Mw1 of the silicone base material and a weight-average molecular weight Mw2 of the viscosity reducing agent (Mw1/Mw2) is 0.5 or more and 8.5 or less. The present invention can provide a thermally conductive composition comprising a silicone base material, a viscosity reducing agent, and a thermally conductive filler, which has a high effect of reducing viscosity.