RESIN COMPOSITION, FILM WITH RESIN, METAL FOIL WITH RESIN, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD

A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene c...

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Bibliographische Detailangaben
Hauptverfasser: OKUNO, Kosuke, KOYAMA, Masaya
Format: Patent
Sprache:eng
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Zusammenfassung:A resin composition contains a polyphenylene ether compound, a styrene block copolymer, a polybutadiene compound, and a curing agent. The polyphenylene ether compound has, in a molecule thereof, at least one of a group expressed by formula (1) or a group expressed by formula (2). The polybutadiene compound has an epoxy group in a molecule thereof. The curing agent contains an allyl compound expressed by formula (3). In the formula (1), p indicates an integer from 0 to 10, Z indicates an arylene group, and R1 to R3 each independently indicate either a hydrogen atom or an alkyl group. In the formula (2), R4 indicates either a hydrogen atom or an alkyl group. In the formula (3), RA indicates either an alkyl group or an alkenyl group, each having 8 to 22 carbon atoms.