FLUX AND SOLDER PASTE

A flux and a solder paste capable of minimizing the time-dependent changes in viscosity when stored at 30° C. and minimizing the coloration of flux residues while having favorable reflow properties and favorable cleanability of flux residues are provided. As such a flux, a flux containing a rosin, a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KANEKO, Mutsuki, HASHIMOTO, Yutaka
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SOLDERING OR UNSOLDERING THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A flux and a solder paste capable of minimizing the time-dependent changes in viscosity when stored at 30° C. and minimizing the coloration of flux residues while having favorable reflow properties and favorable cleanability of flux residues are provided. As such a flux, a flux containing a rosin, a thixotropic agent, an activator, and a solvent is adopted. The rosin includes one or more selected from the group consisting of an acid-modified rosin, a hydrogenated rosin, and an acid-modified hydrogenated rosin, and the thixotropic agent includes a compound represented by General Formula (1). In General Formula (1), R11 and R12 each independently represent a hydrocarbon group which has 1 to 3 carbon atoms and may have a substituent, or a single bond. R21 and R22 each independently represent a hydrocarbon group which has 7 to 29 carbon atoms and may have a substituent. R13 represents a substituent. n represents an integer of 0 to 4.