MICRO BUMP, INTERPOSER FOR ELECTRICAL CONNECTION HAVING SAME, SEMICONDUCTOR PACKAGE, MULTI-LAYER STACKED SEMICONDUCTOR DEVICE, AND DISPLAY

The present invention relates to a micro bump, which is capable of coping with a narrow pitch between terminals and preventing an increase in current density and thermal energy density at a bump connection portion, and to an interposer for electrical connection having same, a semiconductor package, a multi-layer stacked semiconductor device, and a display. The micro bump may be manufactured using: an electrically conductive material part forming step of forming an electrically conductive material part inside a through hole provided in a body made of an anodized film; and a bonding material part forming step of forming a bonding material part on at least a portion of an upper portion and a lower portion of the electrically conductive material part.