METHODS AND APPARATUS TO REDUCE IMPEDANCE DISCONTINUITIES AND CROSSTALK IN INTEGRATED CIRCUIT PACKAGES

Methods, apparatus, systems, and articles of manufacture to reduce impedance discontinuities and crosstalk in integrated circuit packages are disclosed. A disclosed apparatus includes: a package substrate, and a ball grid array on a first surface of the package substrate. The ball grid array includes a first ball and a second ball adjacent the first ball. The ball grid array is to enable the package substrate to be electrically coupled to a circuit board. The apparatus further includes a metal interconnect within the package substrate. The metal interconnect is electrically coupled to the first ball. The metal interconnect includes an inductive loop that extends toward the second ball.