SEMICONDUCTOR MODULE

A semiconductor module includes a semiconductor element, a heat dissipation member thermally connected to the semiconductor element, a resin member, a signal terminal, and a wiring member. The resin member accommodates the semiconductor element, the heat dissipation member, and the wiring member. At...

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Bibliographische Detailangaben
Hauptverfasser:	KUSAMA, HIROTOSHI, INOUE, NARUHIRO, ARAI, SHUNSUKE, MIWA, RYOTA, OMAE, SHOICHIRO, FUKUTANI, KEITA, FURUKAWA, YASUSHI, KATO, TAKAHIDE, NAGAI, SHUNA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor module includes a semiconductor element, a heat dissipation member thermally connected to the semiconductor element, a resin member, a signal terminal, and a wiring member. The resin member accommodates the semiconductor element, the heat dissipation member, and the wiring member. At least a part of the heat dissipation member is exposed from the resin member. The wiring member is a member more flexible than the signal terminal, and includes an electrically insulating resin layer and a metal layer supported by the resin layer. The wiring member connects a signal pad of the semiconductor element and the signal terminal.