SEMICONDUCTOR MODULE
Provided is a semiconductor module comprising a semiconductor chip, a wire formed on an insulating substrate, and a lead frame, the semiconductor module having a higher heat-dissipating effect than before. A semiconductor module 10 of the present invention comprises an insulating substrate 1, a wire...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | Provided is a semiconductor module comprising a semiconductor chip, a wire formed on an insulating substrate, and a lead frame, the semiconductor module having a higher heat-dissipating effect than before. A semiconductor module 10 of the present invention comprises an insulating substrate 1, a wire 2 formed on the insulating substrate 1, a semiconductor chip 3, and a lead frame 4, and is characterized in that the semiconductor chip 3 has one surface connected to the wire 2 and another surface connected to the lead frame 4, the wire 2 has a floating wire to which the lead frame 4 is connected, and a connection point between the floating wire and the lead frame 4 is located at a corner of the insulating substrate 1. |
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