ENERGY-SAVING HEAT TREATMENT DEVICE FOR METAL SUBSTRATE IN CORROSIVE GAS

An energy-saving heat treatment device for a metal substrate in a corrosive gas includes a process frame located in a radiation field. A substrate is configured to be inserted in the process frame, and the process frame covers an outer edge of an upper surface of the substrate to form a process space having a small volume. The process frame is made on the basis of the modification to the structure of the original process frame. By covering the outer edge of the substrate, the edge is protected from contact with selenium, and chalcogen elements in contact with the edge are reduced, and even residual chalcogen elements or hydrocarbons in a chamber do not corrode the edge of the substrate. Since the process space is minimized, the chalcogenide elements in the process chamber are greatly reduced, and a barrier layer on a bottom side of the substrate is significantly thinned.