LOW-DIELECTRIC-TANGENT SILICA SOL, AND METHOD FOR PRODUCING LOW-DIELECTRIC-TANGENT SILICA SOL

Silica particles have a dielectric loss tangent of 0.01 or less at 1 GHz and satisfy the requirements (i), (ii) and (iii): (i) an average primary particles diameter of 5 nm to 120 nm; (ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adso...

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Bibliographische Detailangaben
Hauptverfasser:	NAKADA, Takeshi, SUGISAWA, Masatoshi, ARAKI, Megumi, EBARA, Kazuya
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES PREPARATION OF CARBON BLACK THEIR PREPARATION OR CHEMICAL WORKING-UP TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS,TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	Silica particles have a dielectric loss tangent of 0.01 or less at 1 GHz and satisfy the requirements (i), (ii) and (iii): (i) an average primary particles diameter of 5 nm to 120 nm; (ii) a ratio of a specific surface area by water vapor adsorption (SH2O) to a specific surface area by nitrogen adsorption (SN2 i.e., (SH2O/SN2) of 0.6 or less; and (iii) a total silanol group content of 5% or less as determined by the following Formula (1): total silanol group content (%)=(Q2×2/4+Q3×1/4+Q4×0/4) . . . Formula (1) [in Formula (1), each of Q2, Q3 and Q4 is the proportion (%) of the peak areas derived from silicon atom structures], and a silica dispersion.