PROCESSING APPARATUS AND ELECTRONIC COMPONENT MANUFACTURING METHOD
A processing apparatus includes a rotatable blade, a blade driving shaft, a table, a position driving mechanism, a first sensor, a second sensor, a start/stop point information extraction section, a characteristic-vibration-information extraction section, and a characteristic-vibration-information e...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A processing apparatus includes a rotatable blade, a blade driving shaft, a table, a position driving mechanism, a first sensor, a second sensor, a start/stop point information extraction section, a characteristic-vibration-information extraction section, and a characteristic-vibration-information extraction section. The shaft drives the blade. The table places a workpiece to be processed. The mechanism changes a relative position between the blade and the workpiece. The first sensor detects a vibration generated by driving the blade. The second sensor detects a vibration generated by driving the blade. The start/stop point information extraction section extracts at least one of a start point information regarding a contact start point and a stop point information regarding a contact stop point based on a detection result of the second sensor. The characteristic-vibration-information extraction section extracts a characteristic vibration information regarding a predetermined characteristic vibration and determines a position of the characteristic vibration. |
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