METHOD FOR MANUFACTURING ACOUSTIC WAVE ELEMENT AND ACOUSTIC WAVE ELEMENT

A method for manufacturing an acoustic wave element including a support substrate, a piezoelectric material layer on the support substrate, and a functional electrode on the piezoelectric material layer, includes preparing a wafer in which the support substrate and the piezoelectric material layer a...

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Bibliographische Detailangaben
Hauptverfasser:	JONOSONO, Shinya, NODAKE, Naohiro, INOUE, Kazunori, YAMANE, Takashi, KUBO, Shintaro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRONIC CIRCUITRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS RESONATORS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for manufacturing an acoustic wave element including a support substrate, a piezoelectric material layer on the support substrate, and a functional electrode on the piezoelectric material layer, includes preparing a wafer in which the support substrate and the piezoelectric material layer are laminated, thinning the support substrate of the wafer, and after the thinning the support substrate, cutting the wafer with a dicing machine to singulate the acoustic wave element.