MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND METHOD FOR FORMING METAL LINE IN SEMICONDUCTOR DEVICE

MATERIAL FOR METAL LINE, METAL LINE IN SEMICONDUCTOR DEVICE AND METHOD FOR FORMING METAL LINE IN SEMICONDUCTOR DEVICE

A material including an alloy including aluminum of 99% by weight to 99.8% by weight, copper of 0.1% by weight to 0.5% by weight, and scandium of 0.1% by weight to 0.5% by weight, a metal line in a semiconductor device including the material, and a method for forming the metal line in the semiconduc...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GUO, Wei, HE, Wulin, CHOI, Buseo, PARK, Sanghyun, CHUNG, Wonwoong, LEE, Eunyoung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Zusammenfassung:A material including an alloy including aluminum of 99% by weight to 99.8% by weight, copper of 0.1% by weight to 0.5% by weight, and scandium of 0.1% by weight to 0.5% by weight, a metal line in a semiconductor device including the material, and a method for forming the metal line in the semiconductor device may be provided.