SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

A semiconductor device includes a stack disposed over a peripheral circuit. The stack includes alternately stacked insulating layers and sacrificial layers. The semiconductor device also includes a first contact structure penetrating through the stack to connect with the peripheral circuit. The firs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KIM, Jae Taek
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A semiconductor device includes a stack disposed over a peripheral circuit. The stack includes alternately stacked insulating layers and sacrificial layers. The semiconductor device also includes a first contact structure penetrating through the stack to connect with the peripheral circuit. The first contact structure includes a protruding part extending outward from a sidewall of the first contact structure. The semiconductor device further includes a second contact structure disposed on the first contact structure. The second contact structure is connected to the protruding part of the first contact structure.