SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

A method of fabricating a semiconductor package may include providing a substrate, forming a seed layer to cover a top surface of the substrate, sequentially stacking a sacrificial layer and a photoimageable layer on the seed layer, forming a penetration hole to penetrate the photoimageable layer an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOON, OKSEON, SHIM, JIHYE, KIM, KISEOK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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