SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

A method of fabricating a semiconductor package may include providing a substrate, forming a seed layer to cover a top surface of the substrate, sequentially stacking a sacrificial layer and a photoimageable layer on the seed layer, forming a penetration hole to penetrate the photoimageable layer and the sacrificial layer and expose the seed layer, forming a conductive post in the penetration hole, performing a first process to remove at least a portion of the sacrificial layer, performing a second process to remove the photoimageable layer, and patterning or removing the seed layer.