SUBSTRATE PROCESSING SYSTEM INCLUDING DUAL ION FILTER FOR DOWNSTREAM PLASMA

SUBSTRATE PROCESSING SYSTEM INCLUDING DUAL ION FILTER FOR DOWNSTREAM PLASMA

A dual ion filter is arranged between upper and lower chambers of a substrate processing system. The dual ion filter includes upper and lower filters. The upper filter includes a first plurality of through holes configured to filter ions from a plasma in the upper chamber. The lower filter includes...

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Bibliographische Detailangaben
Hauptverfasser: HSU, Chih-Hsun, KAWAGUCHI, Mark, KOSCHE, Serge, WHITTEN, Stephen, CHOKSHI, Himanshu, ZHANG, Dan, BRAVO, Andrew Stratton, AMBUROSE, Gnanamani, KON, Shih-Chung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Beschreibung
Zusammenfassung:A dual ion filter is arranged between upper and lower chambers of a substrate processing system. The dual ion filter includes upper and lower filters. The upper filter includes a first plurality of through holes configured to filter ions from a plasma in the upper chamber. The lower filter includes a second plurality of through holes configured to control plasma uniformity in the lower chamber. A diameter of the first plurality of through holes of the upper filter is less than a diameter of the second plurality of through holes of the lower filter. A number of the first plurality of through holes of the upper filter is greater than a number of the second plurality of through holes of the lower filter.