OPTICAL PACKAGING FEATURES FOR MECHANICAL STABILITY AND OPTICAL FIBER COUPLING

OPTICAL PACKAGING FEATURES FOR MECHANICAL STABILITY AND OPTICAL FIBER COUPLING

An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silico...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: PATEL, Vipulkumar K, SCHLEPPLE, Norbert, PRASAD, Aparna R, PACHON MUNOZ, Arturo
Format: Patent
Sprache:eng
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
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Beschreibung
Zusammenfassung:An optical package with increased mechanical stability of co-packaged optic components is described. The optical package includes an electronic mold compound (EMC) layer with copper pillars formed through the EMC layer. The optical package also includes a silicon interposer layer with through silicon vias (TSVs) and positioned on the EMC layer. A combined thickness of the EMC layer and the silicon interposer layer provide a combined mechanical coupling thickness for a connection component on a smooth diced edge side of the EMC layer and the silicon interposer layer. The optical package also includes devices attached to the silicon interposer layer.