CUTTING TOOL

A cutting tool comprises a substrate and a coating film disposed on the substrate, wherein the coating film comprises a first layer and a second layer; the first layer has a hardness H1 of 25 GPa or more and 40 GPa or less; the second layer has a hardness H2 satisfying 0.5×H1≤H2≤0.9×H1; and at least...

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Bibliographische Detailangaben
Hauptverfasser:	UEDA, Akihiko, KUKINO, Satoru, MOROGUCHI, Hironari, TSUTSUMIUCHI, Yuki, TSUKIHARA, Nozomi
Format:	Patent
Sprache:	eng
Schlagworte:	BORING CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING TURNING
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Beschreibung
Zusammenfassung:	A cutting tool comprises a substrate and a coating film disposed on the substrate, wherein the coating film comprises a first layer and a second layer; the first layer has a hardness H1 of 25 GPa or more and 40 GPa or less; the second layer has a hardness H2 satisfying 0.5×H1≤H2≤0.9×H1; and at least one of a ratio I(200)/(I(200)+I(111)+I(220)) of I(200) of (200) plane to a sum of X-ray diffraction intensity I(200) of (200) plane, X-ray diffraction intensity I(111) of (111) plane, and X-ray diffraction intensity I(220) of (220) plane of the coating film, a ratio I(111)/(I(200)+I(111)+I(220)) of I(111) to the sum, and a ratio I(220/(I(200)+I(111)+I(220)) of I(220) to the sum is 0.45 or more.