ELECTRONIC DEVICE

An electronic device of the present disclosure includes a communication module that includes a communication function, and includes a first module surface and a second module surface opposed to the first module surface, a first heat dissipation material that is disposed on the first module surface,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	TORII, Munehiro, MIKAMI, Shogo, TOBIMATSU, Tatsuya, USUGINU, Yutaro, MAKI, Noriyuki
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	An electronic device of the present disclosure includes a communication module that includes a communication function, and includes a first module surface and a second module surface opposed to the first module surface, a first heat dissipation material that is disposed on the first module surface, an input interface that is operated by a user, a housing that accommodates the communication module, and includes a first surface facing the first module surface and a second surface opposed to the first surface, the input interface being provided on the second surface. The first surface of the housing includes a first recess recessed toward the second surface, and the first recess includes a first wall coming into contact with the first heat dissipation material.