FLOATING HEAT SPREADER WITH GUIDED MECHANISM

A chip package includes a substrate and an integrated circuit ("IC") die mounted to the substrate. A stiffener frame is mounted to the substrate and circumscribes the IC die. The stiffener frame has a plurality of connected walls that define an opening in the stiffener frame. The chip pack...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	REFAI-AHMED, Gamal, RAMALINGAM, Suresh, JAGGERS, Christopher, SHENOY, Sukesh, CHAO, Chi-Yi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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