FLOATING HEAT SPREADER WITH GUIDED MECHANISM

A chip package includes a substrate and an integrated circuit ("IC") die mounted to the substrate. A stiffener frame is mounted to the substrate and circumscribes the IC die. The stiffener frame has a plurality of connected walls that define an opening in the stiffener frame. The chip package also includes a lid having a bottom side facing a top surface of the IC die. The lid has at least a first guide and a second guide extending from the bottom side of the lid. The first guide can be disposed outward or inward of the stiffener frame. The first guide has a side facing an outer wall surface or an inner wall surface of the stiffener frame. The first guide and the second guide are positioned to limit movement of the lid relative to the stiffener frame in two directions.