POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION

The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of...

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Hauptverfasser: HOTTA, Kazutoshi, MORINAGA, Hitoshi, ITO, Yuuichi, YAMADA, Yuta
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creator HOTTA, Kazutoshi
MORINAGA, Hitoshi
ITO, Yuuichi
YAMADA, Yuta
description The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2024254364A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2024254364A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2024254364A13</originalsourceid><addsrcrecordid>eNrjZOgP8PfxDPbw9HNXcPb3DfAP9gzx9PfTUUAI-7qGePi7KIQGgzghHq4KOHQ4-rnA1Lr5BykEBPm7hDpDDXD08fF0VvD19yFoDg8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwMjEyNTE2M3E0NCZOFQBtz0G-</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION</title><source>esp@cenet</source><creator>HOTTA, Kazutoshi ; MORINAGA, Hitoshi ; ITO, Yuuichi ; YAMADA, Yuta</creator><creatorcontrib>HOTTA, Kazutoshi ; MORINAGA, Hitoshi ; ITO, Yuuichi ; YAMADA, Yuta</creatorcontrib><description>The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.</description><language>eng</language><subject>ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; PAINTS ; POLISHES ; POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH ; SKI WAXES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240801&amp;DB=EPODOC&amp;CC=US&amp;NR=2024254364A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240801&amp;DB=EPODOC&amp;CC=US&amp;NR=2024254364A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOTTA, Kazutoshi</creatorcontrib><creatorcontrib>MORINAGA, Hitoshi</creatorcontrib><creatorcontrib>ITO, Yuuichi</creatorcontrib><creatorcontrib>YAMADA, Yuta</creatorcontrib><title>POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION</title><description>The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.</description><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</subject><subject>SKI WAXES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOgP8PfxDPbw9HNXcPb3DfAP9gzx9PfTUUAI-7qGePi7KIQGgzghHq4KOHQ4-rnA1Lr5BykEBPm7hDpDDXD08fF0VvD19yFoDg8Da1piTnEqL5TmZlB2cw1x9tBNLciPTy0uSExOzUstiQ8NNjIwMjEyNTE2M3E0NCZOFQBtz0G-</recordid><startdate>20240801</startdate><enddate>20240801</enddate><creator>HOTTA, Kazutoshi</creator><creator>MORINAGA, Hitoshi</creator><creator>ITO, Yuuichi</creator><creator>YAMADA, Yuta</creator><scope>EVB</scope></search><sort><creationdate>20240801</creationdate><title>POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION</title><author>HOTTA, Kazutoshi ; MORINAGA, Hitoshi ; ITO, Yuuichi ; YAMADA, Yuta</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2024254364A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH</topic><topic>SKI WAXES</topic><toplevel>online_resources</toplevel><creatorcontrib>HOTTA, Kazutoshi</creatorcontrib><creatorcontrib>MORINAGA, Hitoshi</creatorcontrib><creatorcontrib>ITO, Yuuichi</creatorcontrib><creatorcontrib>YAMADA, Yuta</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOTTA, Kazutoshi</au><au>MORINAGA, Hitoshi</au><au>ITO, Yuuichi</au><au>YAMADA, Yuta</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION</title><date>2024-08-01</date><risdate>2024</risdate><abstract>The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH
SKI WAXES
title POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T02%3A33%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HOTTA,%20Kazutoshi&rft.date=2024-08-01&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2024254364A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true