POLISHING COMPOSITION, POLISHING METHOD USING THE POLISHING COMPOSITION, AND METHOD FOR PRODUCING METALLIC MOLD USING THE POLISHING COMPOSITION

The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HOTTA, Kazutoshi, MORINAGA, Hitoshi, ITO, Yuuichi, YAMADA, Yuta
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present invention provides a polishing composition which is capable of rapidly removing scratches and exhibits a high polishing rate without deteriorating surface quality. One aspect of the present invention relates to the polishing composition contains abrasive grains having a Mohs hardness of 8 or more, and a dispersing medium, wherein the abrasive grains have two or more local maximum points at different particle sizes in a volume-based particle size distribution measured by a porous electrical resistance method.