PRINTED WIRING BOARD

A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed on the metal particle layer. The...

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Bibliographische Detailangaben
Hauptverfasser:	OKADA, Issei, OKA, Yoshio, YAMAMOTO, Masamichi, AIKAWA, Kenichiro, HASHIZUME, Kayo
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A printed wiring board includes a base film having a first major surface provided with a groove, and a wiring line disposed in the groove. The wiring line includes a metal particle layer disposed at least on a bottom surface of the groove and a plating layer disposed on the metal particle layer. The metal particle layer contains a plurality of metal particles bonded to each other by metallic bonding. A surface of each of the plurality of metal particles is partially coated with an organic film.