CIRCUIT BOARD AND ELECTRONIC DEVICE

The present application relates to a circuit board and an electronic device. The first slit is used to divide the metal layer on the substrate into at least two first regions and second regions that are alternately distributed and mutually insulated in a row direction and a column direction; the sec...

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Bibliographische Detailangaben
Hauptverfasser:	Li, Mingquan, Xu, Wenqin, Sun, Pingru
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The present application relates to a circuit board and an electronic device. The first slit is used to divide the metal layer on the substrate into at least two first regions and second regions that are alternately distributed and mutually insulated in a row direction and a column direction; the second slit in each row direction of the first regions is interrupted by the first extension portion of at least a portion of the metal sheets within the first regions along the column direction; the second slit in each column direction of the second regions is interrupted by the second extension portion of at least a portion of the metal sheets within the second regions along the row direction.