SEMICONDUCTOR CHIP HAVING STEPPED CONDUCTIVE PILLARS

In an implementation, a semiconductor chip includes a device layer, an interconnect layer fabricated on the device layer, the interconnect layer including a conductive pad, and a conductive pillar coupled to the conductive pad. The conductive pillar includes at least a first portion having a first w...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	GHAHGHAHI, FARSHAD, HU, SUMING
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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