IMAGING ELEMENT AND METHOD OF MANUFACTURING IMAGING ELEMENT
An imaging element according to an embodiment of the present disclosure includes: a wiring layer including a plurality of wiring lines extending in one direction; a first barrier film stacked on the wiring layer and having a first edge surface above any wiring line of the plurality of wiring lines;...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An imaging element according to an embodiment of the present disclosure includes: a wiring layer including a plurality of wiring lines extending in one direction; a first barrier film stacked on the wiring layer and having a first edge surface above any wiring line of the plurality of wiring lines; a first insulating film stacked on the wiring layer and the first barrier film; a first air gap provided between the wiring layer and the first insulating film, and provided between the plurality of wiring lines adjacent to each other; and a second air gap provided above the wiring line above which the first edge surface is provided, the second air gap being provided near the first edge surface. |
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