SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Provided is a semiconductor package including a first semiconductor chip, at least one second semiconductor chip on a top surface of the first semiconductor chip, a molding layer on the at least one second semiconductor chip, and a marking layer on at least one side of the molding layer, the marking...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Moon, Kwangjin, Kim, Seokho, Hong, Yikoan
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Provided is a semiconductor package including a first semiconductor chip, at least one second semiconductor chip on a top surface of the first semiconductor chip, a molding layer on the at least one second semiconductor chip, and a marking layer on at least one side of the molding layer, the marking layer including a hydrophobic material, wherein inner sidewalls of the marking layer contact a lower portion of sidewalls of the molding layer.