SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING APPARATUS MAINTENANCE METHOD

A substrate processing apparatus includes a drying unit for replacing a liquid film formed on a substrate with a supercritical fluid to dry the substrate, and a control device. The drying unit includes a pressure container, a supply mechanism for supplying fluid to the pressure container, a discharg...

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Bibliographische Detailangaben
Hauptverfasser:	OOKAWA, Katsuhiro, YAMANAKA, Manabu, YAHATA, Keiichi, OIE, Shuji, TANAKA, Yuichi, UMEZAKI, Shota, OMAGARI, Tomotaka, MORIYAMA, Shigeru, ITAHASHI, Takuya
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING DRYING DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A substrate processing apparatus includes a drying unit for replacing a liquid film formed on a substrate with a supercritical fluid to dry the substrate, and a control device. The drying unit includes a pressure container, a supply mechanism for supplying fluid to the pressure container, a discharge mechanism for discharging the fluid from the pressure container, a panel for separating an internal space from an external space, an electromagnetic lock, and a concentration sensor for detecting a concentration of the fluid. An unlocking condition for the control device to switch a state of the electromagnetic lock from a locked state to an unlocked state includes a condition that a detection value of the pressure sensor is less than or equal to a first threshold value and a condition that a detection value of the concentration sensor is less than or equal to a second threshold value.