APPARATUS AND METHOD FOR MEASURING A LAYER OF A SEMICONDUCTOR DEVICE USING X-RAY DIFFRACTION

An apparatus for measuring a thickness of a metal layer includes a light source unit configured to generate X-rays, a detection unit configured to detect the X-rays diffracted from a specimen, and a processor configured to measure the thickness of the metal layer of the specimen using an intensity o...

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Bibliographische Detailangaben
Hauptverfasser: Lee, Seungchul, Sohn, Younghoon
Format: Patent
Sprache:eng
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Zusammenfassung:An apparatus for measuring a thickness of a metal layer includes a light source unit configured to generate X-rays, a detection unit configured to detect the X-rays diffracted from a specimen, and a processor configured to measure the thickness of the metal layer of the specimen using an intensity of the X-rays diffracted from the specimen.