MOLD RELEASE FOR ENGINEERED STONE AND OTHER MOLD RELEASE APPLICATIONS

A homogeneous, aqueous mold release solution including: 5 to 90 wt % water; 3 to 40 wt % polyvinyl alcohol; 0.01 to 3.2 wt % surfactant; 1 to 20 wt % sugar alcohol; 0.005 to 1.05 wt % defoamer; and up to 50 ppm biocide, where a total of all components adds to 100 wt %. The mold release solutions hav...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Wurm, David B, Shitera, George, Nguyen, Vinh
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY FUELS INDEXING SCHEME ASSOCIATED WITH SUBCLASS C10M RELATING TO LUBRICATINGCOMPOSITIONS LUBRICANTS LUBRICATING COMPOSITIONS METALLURGY PEAT PERFORMING OPERATIONS PETROLEUM, GAS OR COKE INDUSTRIES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TECHNICAL GASES CONTAINING CARBON MONOXIDE TRANSPORTING USE OF CHEMICAL SUBSTANCES EITHER ALONE OR AS LUBRICATINGINGREDIENTS IN A LUBRICATING COMPOSITION WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A homogeneous, aqueous mold release solution including: 5 to 90 wt % water; 3 to 40 wt % polyvinyl alcohol; 0.01 to 3.2 wt % surfactant; 1 to 20 wt % sugar alcohol; 0.005 to 1.05 wt % defoamer; and up to 50 ppm biocide, where a total of all components adds to 100 wt %. The mold release solutions have a viscosity in a range from 20 to 600 cps when measured at 23° C. In another aspect, embodiments disclosed herein relate to a homogeneous, aqueous mold release solution including: 5 to 85 wt % water; 10.5 to 15 wt % polyvinyl alcohol; 0.56 to 0.8 wt % surfactant; 1 to 8 wt % sugar alcohol; 0.01 to 0.3 wt % defoamer; and up to 50 ppm biocide, wherein a total of all components adds to 100 wt %. Also disclosed are films prepared from the mold release solutions, as well as methods of coating a substrate using such mold release solutions.