COOLING AND SHOCK ISOLATION ARCHITECTURE FOR STANDALONE AND SCALABLE LIQUID COOLING MODULES

Multiple systems for providing liquid and air cooling for IT components is disclosed. The system includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device. The system includes a second module with the at least one liquid heat exchan...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Duncan, Tyler Baxter, Middleton, Anthony
Format:	Patent
Sprache:	eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEANS FOR DAMPING VIBRATION MECHANICAL ENGINEERING PRINTED CIRCUITS SHOCK-ABSORBERS SPRINGS THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	Multiple systems for providing liquid and air cooling for IT components is disclosed. The system includes a first module with at least one dry cooler that supplies liquid cooling to at least one liquid heat exchange device. The system includes a second module with the at least one liquid heat exchange device that provides liquid cooling to a third module comprising one or more IT units. The third module includes one or more cooling lines in a space beneath a floor that provides liquid cooling to the one or more IT units, with at least one removable floor panel, and one or more shock isolation components for the one or more cooling lines.