CHIP STACKING WITH AN AUXILIARY CIRCUIT CHIP ON A BACKSIDE ILLUMINATED (BSI) SURFACE OF AN IMAGE SENSOR CHIP

CHIP STACKING WITH AN AUXILIARY CIRCUIT CHIP ON A BACKSIDE ILLUMINATED (BSI) SURFACE OF AN IMAGE SENSOR CHIP

A semiconductor device may include a primary circuit chip and an image sensor chip stacked thereon. The image sensor chip may have a backside illuminated (BSI) surface and a frontside surface opposed to the BSI surface, with the image sensor chip being disposed on the primary circuit chip with the f...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: GEURTS, Tomas, BORTHAKUR, Swarnal
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device may include a primary circuit chip and an image sensor chip stacked thereon. The image sensor chip may have a backside illuminated (BSI) surface and a frontside surface opposed to the BSI surface, with the image sensor chip being disposed on the primary circuit chip with the frontside surface facing the primary circuit chip. An auxiliary chip may be disposed on the BSI surface of the image sensor chip and connected to the primary circuit chip through the image sensor chip.