VIRTUAL POWER SUPPLY THROUGH WAFER BACKSIDE

Embodiments of the present invention are directed to processing methods and resulting structures for providing a virtual power supply through a wafer backside. In a non-limiting embodiment of the invention, a front end of line structure having a gate is formed and a back end of line structure is for...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Xie, Ruilong, Joshi, Rajiv
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Embodiments of the present invention are directed to processing methods and resulting structures for providing a virtual power supply through a wafer backside. In a non-limiting embodiment of the invention, a front end of line structure having a gate is formed and a back end of line structure is formed on a first surface of the front end of line structure. A backside power delivery network is formed on a second surface of the front end of line structure opposite the first surface. Source and drain regions on a first side of the gate are connected to the backside power delivery network and source and drain regions on a second side of the gate are connected to the back end of line structure.