CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

CHIP PACKAGE WITH CORE EMBEDDED CHIPLET

Chip packages are described herein that includes chiplets embedded in a core of a substrate of the chip package, such as a package substrate or an interposer. In one example, the chiplet includes voltage regulation circuitry that is coupled through a substrate core embedded inductor to an integrated...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: STRAAYER, Matthew, BOYAPATI, Sri Ranga Sai, HARITSA, Manjunath D, DHAVALESWARAPU, Hemanth Kumar, KULKARNI, Deepak Vasant, NAFFZIGER, Samuel, PFEIFFENBERGER, Alexander Helmut, BURKHART, Justin Michael, SWAMINATHAN, Raja
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Chip packages are described herein that includes chiplets embedded in a core of a substrate of the chip package, such as a package substrate or an interposer. In one example, the chiplet includes voltage regulation circuitry that is coupled through a substrate core embedded inductor to an integrated circuit (IC) die mounted to the substrate.