SEMICONDUCTOR DEVICE

An object is to provide a technique that suppresses peeling of a sealing resin that seals a semiconductor element by a simple method. A semiconductor device includes an insulating substrate provided with a front surface metal pattern a front surface thereof, a semiconductor element mounted on the front surface metal pattern, a wiring wire connected to the front surface electrode of the semiconductor element, a sealing resin that seals the insulating substrate and the semiconductor element, and at least one metal wire arranged around the semiconductor elements on and along the front surface metal pattern. The distance between the semiconductor element and the at least one metal wire is greater than the thickness of the semiconductor element.