ELECTRONIC ASSEMBLIES WITH THERMAL INTERFACE STRUCTURE

Electronic assemblies such as system on a wafer assemblies are disclosed. The assembly can include an electronic component that has a first side, a heat removing structure that is coupled to the first side of the electronic component, and a thermal interface structure that includes a thermal interface layer and an adhesion layer. The electronic component can be a system on a wafer (SoW). The thermal interface layer is positioned between the first side of the electronic component and the heat dissipation structure. The adhesion layer is positioned between the heat removing structure and the thermal interface layer. With the thermal interface structure, the electronic component and the heat removing structure can be attached together with relatively lower pressure.