Composition

A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Lee, Jeong Hyun, Yang, Young Jo, Kang, Yang Gu, Kim, Do Yeon
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	A composition which can be cured at room temperature; and can form a heat dissipation material exhibiting an appropriate level of hardness, low adhesion force, and excellent thermal conductivity, is provided. In addition, the composition can achieve the low adhesion force, and the like without using a plasticizer or the like, or in a state where even if the plasticizer is used, the use ratio thereof is minimized. A product containing the composition, or a cured body thereof is also provided.