LAMINATE OF INORGANIC SUBSTRATE AND HEAT-RESISTANT POLYMER FILM

Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resista...

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Bibliographische Detailangaben
Hauptverfasser:	MIZUGUCHI, Denichirou, TOKUDA, Kaya, OKUYAMA, Tetsuo, MAEDA, Satoshi, YONEMUSHI, Harumi
Format:	Patent
Sprache:	eng
Schlagworte:	LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS TRANSPORTING
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Beschreibung
Zusammenfassung:	Provided is an inorganic substrate/heat-resistant polymer film laminate in which vibration during handling is suppressed. A laminate of a heat-resistant polymer film and an inorganic substrate that uses substantially no adhesive is characterized by that a shear peel strength between the heat-resistant polymer film and the inorganic substrate is 0.8 MPa or more and a tensile modulus of the heat-resistant polymer film is 4-9 GPa.