INTEGRATION OF RADIO FREQUENCY FRONT-END FOR SIZE REDUCTION AND IMPROVED PERFORMANCE

A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency pack...

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Bibliographische Detailangaben
Hauptverfasser: Edwards, Jennifer M, Dalmia, Sidharth S, Signoff, David M
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A radio frequency package for an electronic device with a reduced size and improved performance is presented herein. The radio frequency package includes a front-end package, transceiver dies and at least one antenna array providing a wireless communication functionality for the radio frequency package. The front-end package includes a radio frequency front-end die and at least one power control die connected to an insulation film substrate via first connectors. Each of the transceiver dies is connected to the at least one antenna array using second connectors.