SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Semiconductor package includes lower redistribution layer providing first redistribution wirings and having first region and second region surrounding the first region, semiconductor chip disposed on the first region and electrically connected to the first redistribution wirings, sealing member cove...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Kim, Wooyoung, Cho, Bongju, Lee, Sangkyu, Kim, Jingu, Kwon, Yieok, Lee, Gongje
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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